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Depopulated very-thin Quad Flat-pack No-leads (DQFN)
Introduction
With the current emphasis on long-term cost reduction and supply assurance, we give you an ideal solution.
As the smallest, full-function logic package in the market today, DQFN is the prime successor to the TSSOP package.
In today's design environment with PCB real estate being costly, choosing DQFN is easy:
Lower price for the same logic function in DQFN packaging than in TSSOP
Shorter leadtimes for all new DQFN orders
Shorter leadtimes for all new DQFN orders
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Switch to NXP DQFN today!
Size Matters
The DQFN is a modified HVQFN with some of the terminals depopulated to meet the specified pad counts (currently 14, 16 and 20 pad configurations).
The removal of the terminals reduced the DQFN's body width from that of the HVQFN.
Like the HVQFN, the DQFN is a leadless package where electrical contact is made by soldering the pads on the bottom surface of the package to the board, instead of the conventional formed perimeter leads.
With the removal of the perimeter leads the footprint has decreased to near chip-scale size.
In fact, when compared, The DQFN-14 provides 76% space savings over TSSOP-14, and the DQFN-16 and 20 provide a 73% space savings over the TSSOP-16 and 20 respectively.
This is the smallest package in the industry for standard logic gates and octals.
Key Features
The exposed die paddle technology enhances the thermal and electrical qualities of the package.
The die-attach paddle on the bottom efficiently conducts heat to the board.
Tests comparing the DQFN's thermal performance with TSSOP's show that the DQFN dissapates heat up to 20% more efficiently.
Also, with the contact surfaces beneath the package there is no risk of bent lead or co-planarity problems.
Handling and packaging becomes easier as a result of this.
And, like the VFBGA, the shorter wire length and shorter internal traces improve package performance by up to 20% over TSSOP.
Package inductance is also reduced by 60% and capacitance by 30% over TSSOP.
The DQFN is designed for inline pin-outs.
This makes new board design (or conversion from TSSOP) easier, less expensive, and saves space.
DQFN-14 Pin-Out Diagram
The design of the DQFN package also allows for frequency flexibility in your design.
Its enhanced electrical performance enables, with some design considerations, the standard 2 GHz frequency to be increased up to 10 GHz.
DQFN Dimensions (14-Pad Version)
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