Packaging

Technical Information

Competitor-Package Cross Reference

Package Outline Drawings with Ordering Codes
Standard Packing Quantities

Interpreting Package Markings
Interpreting Identification Labels

Package Moisture Sensitivity Levels (MSL) Data
Package Thermal Resistance (R_th(j-a) & R_th(j-c)) Data

General Information

NXP Semiconductors Lead-Free Packaging FAQ

Family-Specific Information

Package-Specific Information

DQFN Packaging
HVQFN Packaging
LFBGA Packaging
MicroPak XSON Packaging
PicoGate Packaging
VFBGA Packaging

Logic 1G, 2G, and 3G Package Top Markings (Jan 23, 2007)

Literature

	NXP packages at a glance © December 2007; English; Ordering code: 9397 750 16182
	Integrated circuit packages Data handbook IC26 2000 © May 2000; English; Ordering code: 9398 652 90011
	Environment Friendly Status for Logic Products March 18, 2008 © March 18, 2008; English; Ordering code: Not Orderable

Articles Featured in the Press

The Benefits of Standardization in Packaging (in EBN) (Feb 18, 2003)

Standard ICs quick find

	Standard ICs sections
	Product families & functions Literature brochures, leaflets, presentations Packaging specs & SOT #s Support manuals, models, FAQ, software, demoboards Quality handbook, markings Contact sales, distributors